Counter-flow double-layered microchannel heat sinks are very effective for thermal control of electronic components; however, they require rather complicated headers and flow maldistribution can also play a negative role. The cross-flow configuration allows a much simpler header design and the thermal performance becomes similar to that provided by the counter-flow arrangement if the velocity distribution in the microchannels is not uniform. The aim of this work is to show the possibility of achieving a favorable flow distribution in the microchannels of a cross-flow double-layered heat sink with an adequate header design and the aid of additional elements such as full or partial height baffles made of solid or porous materials. Turbulent RANS numerical simulations of the flow field in headers are carried out with the commercial code ANSYS Fluent. The flow in the microchannel layers is modeled as that in a porous material, whose properties are derived from pressure drop data obtained using an in-house FEM code. It is demonstrated that, with an appropriate baffle selection, inlet headers of cross-flow microchannel heat sinks yield velocity distributions very close to those that would allow optimal hotspot management in electronic devices.
