In this work we employ a state-of-the-art Multi-Subband Monte Carlo simulator to investigate the performance of III-V n-MOSFETs with LG = 11.7nm. We analyze GaSb versus InGaAs strained and unstrained channel materials and the implications of Fermi level pinning on electrostatic and transport. We found that InGaAs MOSFETs can outperform strained silicon for low VDD applications. Advantages related to strained InGaAs are limited and mainly due to reduced Fermi Level Pinning.
