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Review of radiation damage studies on DNW CMOS MAPS

Traversi, G.
•
Gaioni, L.
•
Manazza, A.
altro
Cindro, V.
2013
  • journal article

Periodico
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT
Abstract
Monolithic active pixelsensors fabricated in abulk CMOS technology with no epitaxial layer and standard resistivity(10 Ω cm) substrate, featuring a deep N-well as the collecting electrode (DNW MAPS), have been exposed to γ-rays, up to a final dose of 10 Mrad (SiO2), and to neutrons from a nuclear reactor, up to a total 1 MeV neutron equivalent fluence of about 3.7 x 10^13 cm^−2. The irradiation campaign was aimed at studying the effects of radiation on the most significant parameters of the front-end electronics and on the charge collection properties of the sensors. Device characterization has been carried out before and after irradiations. The DNW MAPS irradiated with 60Co γ-rays were also subjected to high temperature annealing (100 C for 168 h). Measurements have been performed through a number of different techniques, including electrical characterization of the front-end electronics and of DNW diodes, laser stimulation of the sensors and tests with 55Fe and 90Sr radioactive sources. This paper reviews the measurement results, their relation with the damage mechanisms underlying performance degradation and provides a new comparison between DNW devices and MAPS fabricated in a CMOS process with high resistivity (1 kΩ cm) epitaxial layer.
DOI
10.1016/j.nima.2013.04.079
Archivio
http://hdl.handle.net/11368/2836174
info:eu-repo/semantics/altIdentifier/scopus/2-s2.0-84888315895
Diritti
metadata only access
Soggetti
  • Analog front-end

  • Bulk damage

  • Charge collection eff...

  • CMOS monolithic activ...

  • Deep N-well

  • Ionizing radiation

  • Instrumentation

  • Nuclear and High Ener...

Scopus© citazioni
0
Data di acquisizione
Jun 14, 2022
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Web of Science© citazioni
0
Data di acquisizione
Mar 28, 2024
Visualizzazioni
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Data di acquisizione
Apr 19, 2024
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