Carrier trapping/detrapping from/to the gate into dielectric traps is often neglected when modeling noise in MOSFETs and, to the best of our knowledge, no systematic study of its impacts on scaled devices is available. In this article, we show that this trapping mechanism cannot be neglected in nowadays aggressively scaled gate dielectric thicknesses without causing errors up to several orders of magnitude in the estimation of the drain current noise. The noise generation mechanism is modeled analytically and then analyzed through the use of 2-D and 3-D TCAD simulations of scaled MOSFETs with different architectures and channel/gate-stack materials. The results provide new insights for technology and device designers, highlight the relevance of the choice of the gate metal work function (WF) and the role of valence band electron trapping at high gate voltages.
