Objectives. This study investigated the effects of an electric field produced by a new device
for the application of etch-and-rinse adhesives on demineralized dentin surfaces.
Methods. Three simplified etch-and-rinse adhesives (Single Bond, Prime&Bond NT and One-
Step) were applied with the electric device and compared with controls prepared with
disposable sponges. Specimens were processed for microtensile bond strength test and
nanoleakage investigation using high resolution SEM.
Results. Microtensile testing revealed higher bond strengths (p < 0.05) for all adhesives tested
when electricity was used. Adhesive interfaces prepared with electric impulses exhibited
very homogenous hybrid layers with minimal nanoleakage compared with the controls.
Significance. The use of electricity produced by a newelectronic device during the application
of dentin adhesives may increase adhesive adaptation to the dentin substrate and improve
dentin hybridization due to the substrate modifications induced by an electric field on the
demineralized dentin organic matrix.
